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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 04.nov.2015 rev.001 3ch clock generator for digital cameras BU2394KN general description this clock generator ic produces three types of clocks for ccd, usb, and video. these clocks are necessary for digital still camera systems and digital video camera systems. these are contained in a single chip with the use of the pll technology. generating these clocks with a single chip allows for simplified design of the clock system. it occupies less space and reduced number of components used for mobile camera equipment which is increasingly being downsized and less costly. features ? connecting a crystal oscillator generates multiple clock signals with a built-in pll. ? the ccd clock provides switching selection outputs. ? providing the output of low period-jitter clock. ? uses compact package vqfn20 which makes it suitable for mobile devices. ? single power supply of 3.3v applications generation of clocks used in digital still camera and digital video camera systems key specifications BU2394KN supply voltage range 3.0v to 3.6v operating temperature range -5c to + 70 c reference input clock 14.318182mhz 28.636363mhz output ccd clock 135.000000mhz 110.000000mhz 108.000000mhz 98.181818mhz output usb clock 48.008022mhz output video clock 14.318182mhz 17.734450mhz package w(typ) x d(typ) x h(max) vqfn20 4.20mm x 4.20mm x 0.95 mm typical application circuit (note) we believe that this circuit is to be recommended. however, to use it, make f urther thorough check for the characteristics. for ccd 135.000000mhz 110.000000mhz 108.000000mhz 98.181818mhz for video 14.318182mhz 17.734450mhz for usb 48.008022mhz r 0.1uf 0.1uf 0.1uf BU2394KN vqfn-20 1 avdd 2 avdd 3 avss 4 xin 5 xout 20 19 _c 18 vdd2 17 vss2 16 c 6 test1 7 xtal_sel 8 fs3 9 fs2 10 fs1 15 vdd1 14 vdd1 13 vss1 12 c 11 c 0.1f 0.1f 0.1f datashee t datashee t downloaded from: http:///
b u2 394kn 2/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 block diagram and pin configuration pin description s pin no. pin name function 1 avdd analog power source 2 avdd analog power source 3 avss analog gnd 4 x in crystal in 5 xout crystal out 6 test1 test pin, normally open, equipped with pull-down 7 xtal_sel crystal oscillator selection, h: 28.636 mhz, l: 14.318 mhz, equipped with pull- up 8 fs3 clk1,2 output selection, equipped with pull- up 9 fs2 clk1,2 output selection, equipped with pull- up 10 fs1 refclk output selection, equipped with pull- up 11 clk1out 110m/98m/108m/135m output 12 clk2on clk2 output control, h: enable, l: disable, equipped with pull- up 13 vss1 clk1/clk2 & internal digital gnd 14 vdd1 clk1/2 & internal digital power supply 15 vdd1 clk1/2 & internal digital power supply 16 clk2out 48m output 17 vss2 refclk gnd 18 vdd2 refclk power supply 19 ref_clk 14.3m/17.7m output 20 test2 test pin, normally open, equipped with pull-down (note) basically, mount ics to the printed circuit board for use. if the ics are not mounted to the printed circuit board, the characte ristics of ics may not be fully demonstrated. mount 0.1f capacitors in the vicinity of the ic pins between pin 1&2 and pin 3, pin 13 and pin 14&15, and pin 17 and pin 18, respectively. as to the jitters, the typ values vary with the substrate, power supply, ou tput loads, noises, and others. also, the operating margin should be thoroughly checked. clk1 clk2 ref_clk data pll1 pll2 pll3 1 4 4 xin xout xtal_sel clk2on fs1 fs2 fs3 xtal osc 5 7 12 10 9 8 11 16 19 135.000000mhz 108.000000mhz 110.000000mhz 98.181818mhz 48.008022mhz 17.734450mhz 14.318182mhz 1 10 1 2 top view downloaded from: http:///
b u2 394kn 3/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 absolute maximum ratings (ta=25c) parameter symbol limit unit supply voltage v dd -0.5 to +7.0 input voltage v in -0.5 to v dd +0.5 storage temperature range tstg - 30 to + 125 c power dissipation pd 0.53 (note 1) w (note 1) derate by 5.3mw/c when operating above ta=25c. (note) operating temperature is not guaranteed. (note) power dissipation is measured when the ic is mounted to the printed c ircuit board. caution: operating the ic over the absolute maximum ratings may damage th e ic. the damage can either be a short circuit between pins or a n open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol limit unit supply voltage v dd 3.0 to 3.6 i nput h voltage v inh 0.8v dd to v dd i nput l voltage v inl 0.0 to 0.2v dd operating temperature topr -5 to + 70 c output load c l 15(max) pf downloaded from: http:///
b u2 394kn 4/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 electrical characteristics (v dd =3.3v, ta=25c, unless otherwise specified.) when xtal_sel=h crystal frequency is 28.636363 mhz. at xtal_sel=l, crystal frequency is 14.318182 mhz parameter symbol limit unit conditions min typ max operating circuit current i dd - 45 60 ma at no load output h voltage clk1 v oh1 v dd -0.5 v dd -0.2 - v when current load = - 9. 0ma clk2 v oh2 v dd -0.5 v dd -0.2 - v when current load = -7.0ma ref_clk v ohr v dd -0.5 v dd -0.2 - v when current load = -4.5ma output l voltage clk1 v ol1 - 0.2 0.5 v when current load =11ma clk2 v ol2 - 0.2 0.5 v when current load =9.0ma ref_clk v olr - 0. 2 0.5 v when current load =5.5ma pull-up resistance value fs1, fs2, fs3, clk2on, xtal_sel pull- up r 125 250 375 monitor pin = 0v (r=vdd/ i) output frequency clk1 fs2:h fs3:h f clk1-1 - 135.000000 - mhz xtal x (1188/63)/2 clk1 fs2:h fs3:l f clk1-2 - 108.000000 - mhz xtal x (1056/70)/2 clk1 fs2:l fs3:l f clk1-3 - 98.181818 - mhz xtal x (864/63)/2 clk1 fs2:l fs3:h f clk1-4 - 110.000000 - mhz xtal x (968/63)/2 clk2 f clk2-2 - 48.008022 - mhz xtal x (228/17)/4 ref_clk fs1:h f ref1-1 - 14.318182 - mhz xt al output ref_clk fs1:l f ref1-2 - 17.734450 - mhz xtal x (706/57)/10 output waveform duty1 100mhz or less duty1 45 50 55 measured at a voltage of 1/2 of vdd duty2 100mhz or more duty2 - 50 - measured at a voltage of 1/2 of vdd rise time t r - 2.5 - nsec period of transition time required for the output to reach 80% from 20% of vdd. fall time t f - 2.5 - nsec period of transition time required for the output to reach 20% from 80% of vdd. jitter period-jitter 1 p- j1 - 30 - psec (note 1) period-jitter min-max p-j min-max - 180 - psec (note 2) output lock-time t lock - 1 msec (note 3) (note) the output frequency is determined by the arithmetic (freq uency division) expression of a frequency input to xtalin. if th e input frequency is set to values shown below, the output frequency will be as listed above. when xtal_sel is set to h, the input frequency on xtalin will be 28.6 36363 mhz. when xtal_sel is set to l, the input frequency on xtalin will be 14.318182 mhz. (note 1) period- jitter 1 this parameter represents standard deviation ( =1) on cycle distributio n data at the time when the output clock cycles are sampled 1000 tim es consecutively with the tds7104 digital phosphor oscilloscope of tektronix japan, ltd. (note 2) period-jitter min-max this parameter represents a maximum distribution width on cycle d istribution data at the time when the output clock cycles are sampl ed 1000 times consecutively with the tds7104 digital phosphor oscilloscope of tektronix japan, ltd. (note 3) output lock-time the lock-time represents the elapsed time after power supply turns on to reach a 3.0v voltage, after the system is switched from power-down state to normal operation state, or after the output frequency is switched u ntil it is stabilized at a specified frequency, respectively. downloaded from: http:///
b u2 394kn 5/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves (basic data) figure 3. 135mhz spectrum (at v dd =3.3v and c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 1. 135mhz output wave (at v dd =3.3v and c l =15pf) 1.0nsec/div 1.0v/div figure 4. 110mhz output wave (at v dd =3.3v and c l =15pf) 2.0nsec/div 1.0v/div figure 2. 135mhz period-jitter (at v dd =3.3v and c l =15pf) 500psec/div 1.0v/div downloaded from: http:///
b u2 394kn 6/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 8. 108mhz period-jitter (at v dd =3.3v and c l =15pf) 500psec/div 1.0v/div figure 7. 108mhz output wave (at v dd =3.3v and c l =15pf) 2.0nsec/div 1.0v/div figure 5. 110mhz period-jitter (at v dd =3.3v and c l =15pf) 500psec/div 1.0v/div figure 6. 110mhz spectrum (at v dd =3.3v and c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz downloaded from: http:///
b u2 394kn 7/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 11 . 98mhz period-jitter (at v dd =3.3v and c l =15pf) 500psec/div 1.0v/div figure 12 . 98mhz spectrum (at v dd =3.3v and c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 9. 108mhz spectrum (at v dd =3.3v and cl=15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 10 . 98mhz output wave (at v dd =3.3v and cl=15pf) 2.0nsec/div 1.0v/div downloaded from: http:///
b u2 394kn 8/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 14 . 48mhz period-jitter (at v dd =3.3v and c l =15pf) 500psec div 1.0v/div figure 16 . 17.7mhz output wave (at v dd =3.3v and c l =15pf) 10.0nsec/div 1.0v/div figure 15 . 48mhz spectrum (at v dd =3.3v and c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 13 . 48mhz output wave (at v dd =3.3v and c l =15pf) 5.0nsecdiv 1.0v/div downloaded from: http:///
b u2 394kn 9/ 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 18 . 17.7mhz spectrum (at v dd =3.3v and c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz figure 19 . 14.3mhz output wave (at v dd =3.3v and c l =15pf) 10.0nsec div 1.0v/div figure 20 . 14.3mhz period-jitter (at v dd =3.3v and c l =15pf) 500psec/div 1.0v/div figure 17 . 17.7mhz period-jitter (at v dd =3.3v and c l =15pf) 500psec/div 1.0v/div downloaded from: http:///
b u2 394kn 10 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 21 . 14.3mhz spectrum (at v dd =3.3v and c l =15pf) 10khz/div 10db /div rbw=1khz vbw=100hz downloaded from: http:///
b u2 394kn 11 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued (temperature and supply voltage variations data) figure 22 . duty vs temperature (135mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 25 . duty vs temperature (110mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 24 . period-jitter min-max vs temperature (135mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period-jitter min-max : pj-min-max [psec] figure 23. period- jitter 1 vs temperature (135mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period- jitter 1 : pj - 1 [psec] downloaded from: http:///
b u2 394kn 12 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 26. period-jitter 1 vs temperature (110mhz) figure 27 . period-jitter min-max vs temperature (110mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period-jitter min-max : pj-min-max [psec] 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period- jitter 1 : pj - 1 [psec] figure 29. period- jitter 1 vs temperature (108mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period- jitter 1 : pj - 1 [psec] figure 28 . duty vs temperature (108mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] downloaded from: http:///
b u2 394kn 13 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 31 . duty vs temperature (98mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 30 . pe riod-jitter min-max vs temperature (108mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] figure 33 . period-jitter min-max vs temperature (98mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =2.9v v dd= 3.3v v dd =3.7v temperature : ta [c] period-jitter min-max : pj-min-max [psec] period-jitter min-max : pj-min-max [psec] figure 32. period- jitter 1 vs temperature (98mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] period- jitter 1 : pj - 1 [psec] downloaded from: http:///
b u2 394kn 14 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 35. period- jitter 1 vs temperature (48mhz) figure 34 . duty vs temperature (48mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 37 . duty vs temperature (17.7mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 36 . period-jitter min-max vs temperature (98mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =3.7v v dd =3.3v v dd =2.9v temperature : ta [c] period-jitter min-max : pj-min-max [psec] 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =3.7v v dd =3.3v v dd =2.9v temperature : ta [c] per iod - jitter 1 : pj - 1 [psec] downloaded from: http:///
b u2 394kn 15 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 40 . duty vs temperature (14.3mhz) 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature t[ ] duty duty[%] v dd =2.9v v dd =3.3v v dd =3.7v temperature : ta [c] duty : duty [%] figure 38. period- jitter 1 vs temperature (17.7mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =3.7v v dd =3.3v v dd =2.9v temperature : ta [c] period- jitter 1 : pj - 1 [psec] fi gure 41. period- jitter 1 vs temperature (14.3mhz) 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte r1 p j-1 [psec] v dd =3.7v v dd =3.3v v dd =2.9v temperature : ta [c] period- jitter 1 : pj - 1 [psec] figure 39 . period-jitter min-max vs temperature (17.7mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =3.7v v dd =3.3v v dd =2.9v temperature : ta [c] period-jitter min-max : pj-min-max [psec] downloaded from: http:///
b u2 394kn 16 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 typical performance curves C continued figure 43 . operating circuit current vs temperature (at 1chip operation) 0 10 20 30 40 50 60 -25 0 25 50 75 100 temperature t[ ] idd idd[ma ] v dd =3.7v v dd =3.3v v dd =2.9v temperature : ta [c] operating circuit current: i dd [ma] figure 42 . period-jitter min-max vs temperature (14.3mhz) 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature t[ ] p erio d-ji tte rmin-ma x p j-min-ma x [p sec] v dd =3.7v v dd =3.3v v dd =2.9v temperature : ta [c] period-jitter min-max : pj-min-max [psec] downloaded from: http:///
b u2 394kn 17 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ics power su pply pins. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the a nalog block. furthermore, connect a capacitor to ground at all pow er supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trace s, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and th ick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground th e ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins durin g assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small ch arge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
b u2 394kn 18 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 operational notes C continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably fo rmed creating parasitic diodes or transistors. the operati on of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic element s to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furtherm ore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supp ly voltage is applied, make sure that the input pins hav e voltages within the values specified in the electrical characte ristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bia s and others. downloaded from: http:///
b u2 394kn 19 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 ordering information b u 2 3 9 4 k n - e 2 part number package kn : vqfn20 package and forming specification e2: reel-like emboss taping marking diagram vqfn 20 (top view) u 2 3 9 4 k part number marking lot number 1pin mark downloaded from: http:///
b u2 394kn 20 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 physical dimension, tape and reel information package name vqfn 20 < tape and reel information > tape embossed carrier tape with dry pack quantity 2500 pcs direction of feed e2 the direction is the pin 1 of product is at the upper left when you ho ld reel on the left hand and you pull out the tape on the right hand (unit mm) caution don t recommended soldering at corner downloaded from: http:///
b u2 394kn 21 / 21 tsz02201-0e3e0j500700-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 04.nov.2015 rev.001 revision history date revision changes 04.nov.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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